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Lapping Machine- Double side polisher
- Single side polisher
- Single side grinder -
Cleansing Machine- 9 tanks in-line ultrasonic
- 8 tanks in-line ultrasonic
- 3 tanks in-line ultrasonic -
Coating Machine- E-beam evaporator
- E-beam evaporator + Ion source
- Magnetron sputter -
Spectrophotometer- FT-IR, 1200~28000nm
- Spectrophotometer, 185~3300nm -
Cutting Machine* Dicing saw
- Liner cutting tolerance ±0.01~0.02mm -
Cutting Machine* CNC scriber
- Varied by substrate thickness
- Circular cutting tolerance ±0.1mm
- Linear cutting tolerance ±0.02mm -
Cutting Machine* Shape Router
- Cutting precision: tolerance ±0.05mm
- Routing size: up to 305x305mm -
Dimensional and Defect Inspector- microscope - 500x
- microscope - 90x(digital), 5x(optical) -
Visual Inspection- Reference by MIL-PRF-13830
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Environmental Chamber- Temp.: -40~150 degree C
- Humidity Range: 20%~98% R.H -
Peeling Test- Reference by ISO 9211-4-2006
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Assembly Line- 100K+/M capacity for DLP projection components