TECHNOLOGY

  • Lapping Machine

    - Double side polisher
    - Single side polisher
    - Single side grinder

  • Cleansing Machine

    - 9 tanks in-line ultrasonic
    - 8 tanks in-line ultrasonic
    - 3 tanks in-line ultrasonic

  • Coating Machine

    - E-beam evaporator     
    - E-beam evaporator + Plasma source
    - E-beam evaporator + Ion source 
    - Magnetron sputter 

  • Spectrophotometer

    - PerkinElmer FT-IR, 1200~28000nm
    - PerkinElmer Lambda 900, 185~3300nm
    - PerkinElmer Lambda1050, 185~3300nm
    - Varian Cary 50, 190~1100nm 
    - Ocean Optics Array LS-1, 360~2000nm

  • Cutting Machine

    * Dicing saw
    - Liner cutting tolerance ±0.01~0.02mm

  • Cutting Machine

    * CNC scriber
    - Varied by substrate thickness
    - Circular cutting tolerance ±0.1mm
    - Linear cutting tolerance ±0.02mm 

  • Cutting Machine

    * Shape Router
    - Cutting precision: tolerance ±0.05mm
    - Routing size: up to 305x305mm

  • Dimensional and Defect Inspector

    - Leica microscope VMM-2000 - 500x
    - ShengTek  microscope View 250 - 90x(digital), 5x(optical)

  • Visual Inspection

    - Reference by MIL-PRF-13830

  • Environmental Chamber

    - Temp.: -40~150 degree C 
    - Humidity Range: 20%~98% R.H

  • Peeling Test

    - Reference by ISO 9211-4-2006

  • Assembly Line

    - 100K+/M capacity for DLP projection components